| 摘要 |
According to the invention, in order to be able to place an electronic standard component on a circuit board as a surface-mounted SMD component, in particular a Hall IC with an electronic circuitry encapsulated in a housing and connector legs extending from the housing for plugging-in on a circuit board, a mounting frame made from injection moulding material is provided, by means of transfer moulding around the circuit component housing. Said frame comprises a support seat on an underside for seating on the circuit board, with a section of each contact leg embedded in the moulding material with a positive fit and running as far as the underside of the mounting frame, where an end section of each connector leg, not embedded in the moulding material is bent roughly parallel to the support seat and arranged in recesses on the support seat. |
