| 摘要 |
The present invention relates to micro electromechanical systems (MEMS) devices and more specifically to a process for manufacturing MEMS devices having at least one suspended structural element. The present invention seeks to provide an improved method for manufacture of MEMS devices having improved safety and increased yield and throughput compared to conventional EDP immersion process techniques. MEMS devices are made using a modified dissolution process that removes, in a selective etch step, inactive silicon to release an active silicon device from a sacrificial substrate. The present invention uses a selective etchant in conjunction with a commercial spray acid processing tool to provide a dissolution process with improved throughput, improved repeatable and uniform etch rates and reduction in the number of processing steps and chemical containment for improved safety. When the etch process is complete, the solvent spray is turned off and a spray of de-ionized water is directed onto composite structure to remove residual solvent without causing suspended elements to adhere to the support substrate.
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