发明名称 LASER BEAM MACHINING METHOD OF RESIN FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a high quality laser beam machining method to improve dimensional and positional accuracy and to prevent lowering quality of a processed material due to adherence of processed medium. SOLUTION: A laser beam machining method of a resin film to adhere a copper foil with an acrylic plastic adhesive layer of 5 to 100μm thickness having a surface peeling strength of 0.04 to 5.0 N/cm at a first laser irradiating surface of resin film 3, and to form an opening part 6 at the copper foil layer of multi-layered film. And then, at the opposite side of the first surface, to adhere the copper foil with an adhesive layer or protected film 4 consisting of the adhesive layer and the copper foil layer or Japanese paper or a polyester resin protected film layer to form a multi-layered substrate for laser beam machining. And to irradiate a carbon dioxide laser beam swept continuously oscillated at the prescribed range of this multilayered substrate including the opening part of the first surface and to peel the copper foil with an adhesive layer adhered to both surfaces the protected film after laser beam machining.</p>
申请公布号 JP2002001560(A) 申请公布日期 2002.01.08
申请号 JP20000184612 申请日期 2000.06.20
申请人 NIPPON STEEL CHEM CO LTD 发明人 TANAKA TAKASHI;KONO MITSURU;YOSHIZAWA KEIJI;II SHOICHI
分类号 B23K26/00;B23K26/18;B23K26/38;B29C59/16;(IPC1-7):B23K26/00 主分类号 B23K26/00
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