发明名称 LETTER PAPER WITH NON-CONTACT IC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a letter paper with a non-contact IC module, which is capable of constituting the letter paper by an ordinary printing facility without necessitating any special device for handling the non-contact IC module and capable of securing mass production. SOLUTION: An antenna coil 12 is formed on a film substrate 11 and an IC unit is provided so as to be connected to both pole units 12a, 12b of the antenna coil 12 while the non-contact IC module 18, constituted of the film substrate 11 and the antenna coil 12 in the shape of a film, is provided and the non-contact IC module 18 is bonded to a base paper.
申请公布号 JP2002002157(A) 申请公布日期 2002.01.08
申请号 JP20000190694 申请日期 2000.06.26
申请人 OMRON CORP 发明人 FUKUOKA SHINICHIRO
分类号 B42D15/02;B42D15/10;G06K19/07;G06K19/077 主分类号 B42D15/02
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