| 摘要 |
Two contradictory problems of the reduction in the thickness of semiconductor chips or package parts including the semiconductor chips and the improvement in mechanical strength are solved. A semiconductor wafer where semiconductor elements are formed on a first surface thereof or semiconductor chips formed by dicing the semiconductor wafer are reduced in thickness by grinding the second surface opposite to the first surface, and grinding scratches formed by the grinding are removed to smooth the second surface. Since dicing scratches are formed on side surfaces of the semiconductor chips by dicing, the side surfaces are etched together with the second surface to remove the dicing scratches as well as the grinding scratches, thereby smoothing the second surface and the side surfaces.
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