发明名称 ARTICLE FOR POLISHING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an article and a method for polishing a substrate chemically/mechanically. SOLUTION: A polishing material for use in chemical/mechanical polishing comprises a mesh made of fiber 102 and a binding material 104 for holding the fiber 102 in the mesh. The binding material 104 is cemented between the fiber 102, leaving pores 106 present in spaces between the fiber 102 in the mesh. The fiber 102 and the binding material 104 provide a brittle structure to the polishing material. The fiber 102 may be cellulose and the binding material may be phenolic resin.
申请公布号 JP2002001651(A) 申请公布日期 2002.01.08
申请号 JP20010010529 申请日期 2001.01.18
申请人 APPLIED MATERIALS INC 发明人 ROBERT D TOORUZU
分类号 B24B37/24;B24D3/32;B24D3/34;B24D13/14;H01L21/304 主分类号 B24B37/24
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