发明名称 |
YAG LASER CUTTING DEVICE FOR RADIATION POLLUTANT DISPOSAL EQUIPMENT |
摘要 |
<p>PROBLEM TO BE SOLVED: To improve a YAG laser cutting device for a radiation pollutant disposal equipment capable of cutting the radiation pollutant disposal equipment without carrying the YAG laser device into a decompression working room. SOLUTION: In this invention, an adapter 8 is installed so as to pierce the wall of a working room 4 located in the radiation pollutant disposal equipment 6 and a YAG laser light emitted by a YAG laser oscillator 1, which is located outside the working room, can be transmitted to a laser beam head working in the working room by connecting a an optical fiber cable 2 and 3 to the adapter 8.</p> |
申请公布号 |
JP2002001558(A) |
申请公布日期 |
2002.01.08 |
申请号 |
JP20000180424 |
申请日期 |
2000.06.15 |
申请人 |
HITACHI ENGINEERING & SERVICES CO LTD |
发明人 |
MIBU IKUO;MOGAKI KAZUHIKO;MAEDA KENICHI |
分类号 |
G21F9/30;B23K26/00;B23K26/08;B23K26/38;(IPC1-7):B23K26/00 |
主分类号 |
G21F9/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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