发明名称 YAG LASER CUTTING DEVICE FOR RADIATION POLLUTANT DISPOSAL EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To improve a YAG laser cutting device for a radiation pollutant disposal equipment capable of cutting the radiation pollutant disposal equipment without carrying the YAG laser device into a decompression working room. SOLUTION: In this invention, an adapter 8 is installed so as to pierce the wall of a working room 4 located in the radiation pollutant disposal equipment 6 and a YAG laser light emitted by a YAG laser oscillator 1, which is located outside the working room, can be transmitted to a laser beam head working in the working room by connecting a an optical fiber cable 2 and 3 to the adapter 8.</p>
申请公布号 JP2002001558(A) 申请公布日期 2002.01.08
申请号 JP20000180424 申请日期 2000.06.15
申请人 HITACHI ENGINEERING & SERVICES CO LTD 发明人 MIBU IKUO;MOGAKI KAZUHIKO;MAEDA KENICHI
分类号 G21F9/30;B23K26/00;B23K26/08;B23K26/38;(IPC1-7):B23K26/00 主分类号 G21F9/30
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