发明名称 |
Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
摘要 |
A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900° C. and a bond energy of at least 300 KJ/mol.
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申请公布号 |
US6337463(B1) |
申请公布日期 |
2002.01.08 |
申请号 |
US19990271897 |
申请日期 |
1999.03.18 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
GAKU MORIO;IKEGUCHI NOBUYUKI;TANAKA YASUO;KATO YOSHIHIRO |
分类号 |
B23K26/18;H05K1/03;H05K3/00;H05K3/42;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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