| 摘要 |
PURPOSE: A wafer level package is provided to control a crack on a solder ball, by making a metal wire supported by an upper insulation layer and by mounting the solder ball on the upper end of the metal wire, so that intensity supporting the metal wire is increased and a thick upper insulation layer absorbs thermal stress applied to the solder ball. CONSTITUTION: Bond pads(11) are formed on the surface of a semiconductor chip. A lower insulation layer(20) is applied on the surface of the semiconductor chip to expose the bond pads. Metal patterns(30) are evaporated on the lower insulation layer. One end of the metal patterns are connected to the bond pads and a bonding land is formed at the other end of the metal patterns. A lower end of an S-shaped metal wire(40) is bonded to the bonding land of the metal pattern. An upper insulation layer(50) having a low elastic coefficient is formed on the lower insulation layer to expose only the upper end of the metal wire. A solder ball(80) is mounted on the upper end of the metal wire exposed from the upper insulation layer. |
