Determination of the polishing duration for the surface of an integrated circuit plaques uses Fourier Series to determine polishing duration for removal of a layer of given average thickness

摘要

Method in which initial and final topographical samples of a plaque sample and a sample of the plaque to be polished are transformed into Fourier Series. The polishing duration (T) for the plaque to be polished is taken from the Fourier Series and the average thickness (e-m) to remove. Method for determination of the duration of polishing of the surface of a integrated circuit plaque including a layer of material to be polished on a mechanical-chemical machine. In particular on a polishing machine in which the plaque to be polished is subjected to a set pressure between a rotating head and a polishing tissue carried on a rotating plate and covered by an abrasive material so as to remove a predetermined average thickness from the layer to produce a final determined topography Independent Claims are included for - a detailed method and the formula for Fourier Series transformations.