| 摘要 |
A testing module for use in testing a semiconductor chip for failures in its integrated circuits includes a test fixture, and a decapsulated semiconductor device package mounted to the fixture. The semiconductor device package includes a semiconductor chip having an active front surface at which the integrated circuits are formed, a back which is opposed to the active front, a plurality of leads for electrically connecting the semiconductor chip to an external apparatus, and a package body having a backside which is decapsulated so as to expose the back of the semiconductor chip. The test fixture includes a fixture body having a loading surface contacting the front of the package body and supporting the semiconductor device package, a cover which has an opening through which the back of the semiconductor chip is exposed, and a plurality of projections contacting the leads of the semiconductor device package. The cover is connected to the fixture body but can be opened to allow the semiconductor device package to be inserted into and removed from the test fixture. The test fixture includes a plurality of connection pins having inner ends that are electrically connected to the leads of the semiconductor device package, and outer ends which protrude from the fixture body and are electrically connected to external testing apparatus.
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