| 摘要 |
A manufacturing process for producing dynamic random access memories (DRAMs) having redundant components includes steps for concurrently forming normal (i.e. non-fused) contacts to components of the DRAMs and anti-fused contacts to the redundant components. The process by which the normal and anti-fused contacts are made is readily implemented using standard integrated circuit processing techniques. An anti-fuse contact (20) and a normal (i.e. non-fused) contact (10) are formed by opening respective contact areas in a dielectric (110), selectively forming an insulating layer (210) over the anti-fuse contact, applying polysilicon (212, 410) to cover the insulating layer of the anti-fuse contact and to fill the opening over the normal contact. In one embodiment of the invention, the circuit region served by the anti-fuse contact is subject to ion implantation (810) to improve its conductivity before the anti-fuse contact is formed. In another embodiment of the invention, the anti-fuse is formed in an isolated well (1212) on the integrated circuit device and a non-fused contact (1216) to the well is also provided to aid in blowing the anti-fuse.
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