发明名称 |
Electroplating installation, electrode and support device for this installation and electroplating process |
摘要 |
An electroplating installation for coating the conducting surface of a part. The installation includes electrodes submerged in a bath. The electrodes rest on a support device that serves as a support and a current supply. The electrodes and the support device form an interface defining a plurality of grooves opening into the bath. The grooves may be formed in the electrodes, in the support device, or in both the electrodes and the support device. |
申请公布号 |
US6334943(B1) |
申请公布日期 |
2002.01.01 |
申请号 |
US20000637026 |
申请日期 |
2000.08.14 |
申请人 |
SOLLAC |
发明人 |
GHEERAERT PHILIPPE;VIENNE JEAN-MARIE;VANDENBUSSCHE BERNARD |
分类号 |
C25D17/10;C25D7/06;C25D17/00;(IPC1-7):C25C7/00 |
主分类号 |
C25D17/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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