发明名称 Electroplating installation, electrode and support device for this installation and electroplating process
摘要 An electroplating installation for coating the conducting surface of a part. The installation includes electrodes submerged in a bath. The electrodes rest on a support device that serves as a support and a current supply. The electrodes and the support device form an interface defining a plurality of grooves opening into the bath. The grooves may be formed in the electrodes, in the support device, or in both the electrodes and the support device.
申请公布号 US6334943(B1) 申请公布日期 2002.01.01
申请号 US20000637026 申请日期 2000.08.14
申请人 SOLLAC 发明人 GHEERAERT PHILIPPE;VIENNE JEAN-MARIE;VANDENBUSSCHE BERNARD
分类号 C25D17/10;C25D7/06;C25D17/00;(IPC1-7):C25C7/00 主分类号 C25D17/10
代理机构 代理人
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