发明名称 |
Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment |
摘要 |
A method of fabricating a semiconductor device including: a first step of bonding a conductive wire to any one of a plurality of electrodes of a semiconductor chip; a second step of tearing off the bonded conductive wire in such a manner that a part remains on one of the electrodes; a third step of pressing the part of the conductive wire remaining on the one of the electrodes, to form a bump having a head portion and a base portion; and, a fourth step of bonding a lead to the bump; wherein a distance D between an upper surface of the base portion of the bump and an upper surface of the head portion is such that: 0<D<=6 mum.
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申请公布号 |
US6335568(B1) |
申请公布日期 |
2002.01.01 |
申请号 |
US19990425966 |
申请日期 |
1999.10.25 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
YUZAWA HIDEKI;SAKURAI KAZUNORI |
分类号 |
H01L21/56;H01L21/60;H01L23/485;(IPC1-7):H01L23/48;H01L29/40;H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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