| 摘要 |
A multilayer printed wiring board is provided with a thermal conduction path for dissipating heat generated by an integrated circuit into the air. The multilayer printed wiring board includes: an injection hole for injecting a thermally conductive filler; holes for inspecting the filled state of the thermally conductive filler; a heat dissipating planar conductor that dissipates heat of an inner-layer planar conductor into the air; and through holes for thermally connecting the heat dissipating planar conductor to the inner-layer planar conductor. After packaging an integrated circuit, the thermally conductive filler is injected through the injection hole and into a gap between the integrated circuit and the multilayer printed wiring board, and the filled state of the thermally conductive filler is verified by means of the filled state inspection holes. Heat that is generated in the integrated circuit is conducted via the thermally conductive filler to the surface planar conductor, passes by way of the filled state inspection holes, inner-layer planar conductor, through holes, and heat dissipating planar conductor, and is discharged into the air.
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