Method of fabrication of hybrid smart card with ohmic contacts and delocalized connection passages, uses passages passing through card and filled with conductive material to provide connection between chip and surface of card

摘要

The card is made by initially producing strip conductors (150) connected to contact pads (11) of the chip (10), followed by flip-chip connection of the chip on the terminals (120) of the antenna (20) and on the strip conductors. Connection passages (170) are filled with a conductive material to connect surface contact pads (130) with the strip conductors.