METHODS AND DEVICES FOR ENHANCING BONDED SUBSTRATE YIELDS AND REGULATING TEMPERATURE
摘要
Microfluidic devices include venting channels (206, 208) which may be disposed surrounding a fluid-containing channel (202) to minimize the effects of bond voids.
申请公布号
WO0197974(A1)
申请公布日期
2001.12.27
申请号
WO2001US19595
申请日期
2001.06.18
申请人
CALIPER TECHNOLOGIES CORP.;CHAZAN, DAVID;BOUSSE, LUC, J.;BROOKS, CARLTON;LOUCH, DEREK;SPAID, MICHAEL, R.
发明人
CHAZAN, DAVID;BOUSSE, LUC, J.;BROOKS, CARLTON;LOUCH, DEREK;SPAID, MICHAEL, R.
