发明名称 Lead-free plain bearing and method for its manufacture
摘要 A lead-free plain bearing is formed by dispersing an alloy powder formed from 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, and Cu on a backing, such as a steel plate, and sintering. The alloy powder may further include one or more of 0.05-0.5 mass percent of molybdenum disulfide powder and 0.1-2 mass percent of graphite powder. The bearing surface may be rough finished by machining to a roughness of 0.3-1 mum Ra and then fine finished by polishing to a roughness of at most 0.1 muRa.
申请公布号 US2001055695(A1) 申请公布日期 2001.12.27
申请号 US20010810341 申请日期 2001.03.19
申请人 SATO ISSAKU;SATO NAOKI 发明人 SATO ISSAKU;SATO NAOKI
分类号 B22F7/00;B22F3/10;B22F3/14;B22F3/24;B22F7/02;B22F7/04;C22C1/04;C22C1/05;C22C9/02;F04B27/08;F04B27/10;F16C33/12;(IPC1-7):B32B15/16 主分类号 B22F7/00
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