| 发明名称 |
Method for making electrical contact with a rear side of a semiconductor substrate during its processing |
| 摘要 |
A method for electrically contacting a rear side of a semiconductor substrate when processing the semiconductor substrate includes the step of placing the semiconductor substrate with a substrate rear side on a substrate holder such that an electrically conductive contact layer formed of a semiconductor material is disposed between the semiconductor substrate and the substrate holder.
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| 申请公布号 |
US2001055858(A1) |
申请公布日期 |
2001.12.27 |
| 申请号 |
US20010871013 |
申请日期 |
2001.05.31 |
| 申请人 |
BIRNER ALBERT;FRANOSCH MARTIN;GOLDBACH MATTHIAS;LEHMANN VOLKER;LUTZEN JORN |
发明人 |
BIRNER ALBERT;FRANOSCH MARTIN;GOLDBACH MATTHIAS;LEHMANN VOLKER;LUTZEN JORN |
| 分类号 |
H01L21/683;(IPC1-7):H01L21/44;H01L21/326;H01L21/479 |
主分类号 |
H01L21/683 |
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