发明名称 Heat-peelable pressure-sensitive adhesive sheet
摘要 A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 1012 OMEGA/square or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 mum or less and a maximum surface roughness of 5 mum or less. The adhesive sheet may have a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.
申请公布号 US2001055678(A1) 申请公布日期 2001.12.27
申请号 US20010853787 申请日期 2001.05.14
申请人 NITTO DENKO CORPORATION 发明人 MURATA AKIHISA;OSHIMA TOSHIYUKI;ARIMITSU YUKIO;KIUCHI KAZUYUKI
分类号 C09J7/02;C09J11/08;C09J201/00;H01L21/683;(IPC1-7):B32B7/12;B32B15/04 主分类号 C09J7/02
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