发明名称 METHOD OF MANUFACTURING MULTILAYERED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To enable an efficient manufacture of a ceramic multilayered board having a good flatness and a cavity. SOLUTION: In the method for manufacturing a ceramic multilayered board, an unsintered ceramic laminate having a peeling layer for prevention of tightness between layers therein is compressed, a part of the laminate corresponding to a cavity is removed so that the peeling layer is provided at the bottom of the cavity, and an unsintered ceramic laminate with the obtained cavity is sintered.
申请公布号 JP2001358247(A) 申请公布日期 2001.12.26
申请号 JP20000178796 申请日期 2000.06.14
申请人 MURATA MFG CO LTD 发明人 HARADA HIDEYUKI;TAKAGI HIROSHI
分类号 B32B38/10;H01L21/48;H01L23/12;H01L23/13;H05K1/03;H05K1/18;H05K3/46 主分类号 B32B38/10
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