发明名称 METHOD FOR MANUFACTURING EXPOSURE SUBSTRATE AND METHOD FOR MANUFACTURING PHOTOELECTRIC DEVICE, AND EXPOSURE SUBSTRATE AND PHOTOELECTRIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing an exposure substrate and a method for manufacturing a photoelectric device, and an exposure substrate and a photoelectric device by which the generation of distortion during alignment step can be easily observed, when an exposure substrate and a photoelectric device are manufactured through a projection alignment step using a projection optic system. SOLUTION: Hole patterns 400 as an alignment evaluation pattern are arranged in four corners of a TFT array substrate 10 forming a photoelectric device, through a projection alignment step using a projection optic system. The shape of every hole pattern 400 arranged therein is observed, thereby finding distortion during the alignment step.</p>
申请公布号 JP2001358050(A) 申请公布日期 2001.12.26
申请号 JP20000176963 申请日期 2000.06.13
申请人 SEIKO EPSON CORP 发明人 KOIDE SEIKI
分类号 G02F1/13;G02F1/136;G02F1/1368;G03F1/68;G03F1/70;H01L21/027;(IPC1-7):H01L21/027;G03F1/08 主分类号 G02F1/13
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