IC MODULE AND NON-CONTACT COMMUNICATION TYPE SEMICONDUCTOR DEVICE PROVIDED WITH THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an IC module which has a low occurrence rate of detective products and excellent durability and also to provide a non-contact communication type semiconductor device that is provided with the IC module. SOLUTION: An IC module 10 includes an IC chip 1 having a bump 2 formed on an input/output terminal 1a and an antenna coil 3 consisting of a winding coil. The conductor 3b of the coil 3 is directly connected to the bump 2 and height A of the bump 2 with connected conductor 3b is set larger than deformation value B of the coil 3 at the connection part of them. Thereby the abutting of the coil 3 on the chip surface of the chip 1 is evaded when they are connected together and the necessary pressing force can be loaded on the connection part of the coil and chip. As a result, the bump 2 can be firmly connected to the coil 3. The coil can also use a plane coil having a pattern that is formed on a circuit board.