WIRING BOARD AND METHOD AND DEVICE FOR MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To solve the problem of interfacial fracture caused by an oxide film of nickel when soldering is carried out. SOLUTION: Excellent soldering for excellent connection reliability is performed by combining an electrolytic gold plating process, wherein a gold plating film can be deposited while a nickel oxide film is removed after the electroless plating of an electroless wiring board.