发明名称 FLOOR HEATING PANEL
摘要 PROBLEM TO BE SOLVED: To provide a flood heating panel that floor heating floor can be constructed in a short time with high efficiency without laying a heat insulation material, such as a heat insulation sheets, etc., on an underfloor base material. SOLUTION: The floor heating panel comprises a panel body 10 consisting of a panel base material 11, and back boards 16a and 16b formed of a heat insulation material, such as urethane foamed sheets, etc.; a planar heat generating substance 20 incorporated in the panel body 10; a source wire 30a and an earth wire 30b crossing the panel body 10 in a state to be connected to the planar heat generating substance 20; and a connector 40a on the fixed side and a connector 40b on the moving side connected to the end parts of source wire 30a and the earth wire 30b, respectively. The back boards 16a and 16b are caused to previously stick on the backside of the planar heat generating body 20. Further, a connector containing recessed part 14a on the fixed side to contain and fix a connector 40a on the fixing side and a connector containing recessed part 14b on the moving side to contain the connector 40b on the moving side with the connector 40b on the moving side being capable of being drawn from the panel body 10 are formed at the panel base material 11.
申请公布号 JP2001355862(A) 申请公布日期 2001.12.26
申请号 JP20000174940 申请日期 2000.06.12
申请人 EIDAI CO LTD 发明人 MIWA KAZUHIRO;KOIKE HIROTAKA
分类号 F24D13/02;(IPC1-7):F24D13/02 主分类号 F24D13/02
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