发明名称 LED LEAD FRAME AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an oval or elliptic LED lead frame where the cross-sectional contour at a reflective face part has no linear part. SOLUTION: The LED chip pad part of an LED lead frame and a concave electrode corresponding to the shape of an adjacent reflective face part are made by milling and the concave electrode and a machining block of WC-Co are subjected to electrode discharge machining while facing each other to form a protruding punch on the surface of the machining block of WC-Co. After the protruding punch is polished, an LED lead frame metallic material is pressed using that protruding punch to form an oval or elliptic reflective part and an LED chip pad part where the cross-sectional contour at a reflective face part has no linear part.
申请公布号 JP2001358369(A) 申请公布日期 2001.12.26
申请号 JP20000174735 申请日期 2000.06.12
申请人 ENOMOTO CO LTD 发明人 SONE MASAKI;ENOMOTO TAKANOBU
分类号 H01L23/48;H01L33/62 主分类号 H01L23/48
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