| 摘要 |
PROBLEM TO BE SOLVED: To prevent a first layer conductor wiring from being exposed from a second layer conductor wiring by cutting with a cut line and corroded or generating migration, in a flexible wiring board having structure of plural layers wherein conductor wiring consists of the first layer conductor wiring of a lower layer and the second conductor wiring of an upper layer which covers the upper surface and the side surface of the first layer conductor wiring. SOLUTION: Structure wherein conductor wiring 11A of the lower layer is interrupted in the front and the rear of position where the conductor wiring intersects the cut line 10, and only conductor wiring 12 of the upper layer is continuous. The conductor wiring 11A of the lower layer is covered with the conductor wiring 12 of the upper layer when cutting is performed with the cut line 10. By using metal of high corrosion resistance is used for the conductor wiring layer of the upper layer, corrosion and migration are not generated in the conductor wiring 11A of the lower layer. Before cutting, test terminals 5, 6 are connected electrically with wirings 3A, 4A in a package area 9, through the conductor wiring 12 of the lower layer, so that the test of an IC chip before cutting can be executed by the same method and equipment as the conventional ones. |
