发明名称 GROUNDING STRUCTURE OF FRAME COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a low-cost grounding structure which can securely perform electrical contact with an electronic device contained in electronic equipment, for frame components making up a case structure of the electronic equipment. SOLUTION: With the frame components constituting a case structure of electric equipment, a grounding mechanism part is provided formed by using a part of the frame components. Further, in the processing formation of the grounding mechanism part, an adjusting hole is provided in a connecting part for adjusting the width of the connecting part.
申请公布号 JP2001357907(A) 申请公布日期 2001.12.26
申请号 JP20000176240 申请日期 2000.06.13
申请人 PFU LTD 发明人 DOI HISASHI
分类号 H01R4/64;H05F3/02;H05K7/18;(IPC1-7):H01R4/64 主分类号 H01R4/64
代理机构 代理人
主权项
地址