| 摘要 |
PROBLEM TO BE SOLVED: To provide a microwave package which can achieve accurate shielding and also can realize promotion of miniaturization. SOLUTION: An inner lid mounting part 102 is formed on a peripheral wall of a bottomed cylindrical case body 10 for accommodation of a circuit substrate 13 having high frequency and D.C. circuits formed thereon as associated with the high frequency circuit of the substrate 13, an inner lid 19 with a partition wall 191 electrically connected to a grounding surface of the substrate 13 surrounding the high frequency circuit of the substrate 13 as cooperated with the peripheral wall of the main body 10 is mounted to the case body 10. An outer lid 21 is mounted so as to surround the inner lid 19 and substrate 13 on the opening side of the case body 10 from above the inner lid 19.
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