ELECTRONIC COMPONENT MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting electronic components that can efficiently and securely mount surface mounting parts and ICs onto one substrate. SOLUTION: High-temperature solder paste 4 is supplied to an electrode 2 for mounting the surface mounting parts, surface mounting parts 40 are mounted onto the electrode 2 for temporarily fixing by the paste 4, flux 5 is applied onto an electrode 1 where an IC 30a having eutectic soldering bump should be mounted or is applied to an eutectic soldering bump 31, the IC 30a is mounted onto the electrode 1 for temporarily fixing by the flux 5, a wiring board 10 is heated in high-temperature atmosphere where the high-temperature and eutectic solder is fused, and the surface mounting parts 40 and IC 30a are subjected to reflow soldering.