METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND MULTILAYERED PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which prevent paste from running owing to a decrease in its viscosity caused when hole filling paste charged in a through hole is heated and the surface of the through hole from becoming uneven owing to the paste run and form no unevenness on a subsequently formed buildup layer. SOLUTION: A hole filling mask 500 which has a through hole 600 opposite to a through hole 400 is arranged over a substrate 100, and the hole filling paste 700 of >=300 Pa.s in viscosity at 22 to 23 deg.C is pressed in the former through hole from on the hole filling mask through the latter through hole by using a roller type squeeze 800. After the paste sets through a heat treatment, projections are polished away to flatten the surface.