PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition giving a resist cured film which is cracked by a shock such as spray, ensures a short removal time and is excellent in adhesion and resolution, and to provide a photosensitive element using the composition, a method for producing a resist pattern using the element and a printed wiring board. SOLUTION: The photosensitive resin composition contains (A) a binder polymer containing styrene or its derivative as a copolymerizable component, (B1) 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane, (B2) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group and at least one urethane bond in one molecule and (C) a photopolymerization initiator. The photosensitive element is obtained by applying and drying the photosensitive resin composition on a substrate. The method for producing a resist pattern using the photosensitive element and the printed wiring board are also provided.