| 摘要 |
PROBLEM TO BE SOLVED: To prevent a plating layer from peeling off around a substrate, without deteriorating chips in yield, in a method of forming an embedded wiring layer and a jet-type spin-etching device. SOLUTION: A wiring layer groove 3 and/or a via hole 4 are formed on an insulating layer 2, then a seed layer 6 is formed on the insulating layer 2, a plating layer 7 is formed on the seed layer 6, and then a part of the plating layer 7 is removed through chemical etching. |
