发明名称 SOLID STATE IMAGE SENSOR AND ITS MANUFACTURING METHOD AS WELL AS METHOD FOR MANUFACTURING ON-CHIP LENS MOLD
摘要 PROBLEM TO BE SOLVED: To reduce the number of steps or the like without giving an influence to a formation of an on-chip lens of a uniform shape, a formation of a gapless on-chip lens and an unnecessary position such as a bonding pad or the like, in a method for manufacturing a solid state image sensor having the on-chip lens. SOLUTION: The method for manufacturing the solid state image sensor comprises the steps of covering the solid state image sensor with a lens material layer 41, pressing a mold 31 to a lens material layer 42, and molding the on-chip lens 42.
申请公布号 JP2001358320(A) 申请公布日期 2001.12.26
申请号 JP20000180099 申请日期 2000.06.15
申请人 SONY CORP 发明人 KANBE TERUMI
分类号 H01L27/14;H01L27/148;H01L31/10;H04N5/335;H04N5/372;(IPC1-7):H01L27/14 主分类号 H01L27/14
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