SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability by preventing flanking and fallout of a metal film covering the outside surfaces of resin bumps. SOLUTION: A depression 14 is formed near a portion to be mounted with a device on one surface of a metal base material 10 in such a way as to align in plane arrangement with an external connection terminal 26 electrically connected to a semiconductor device 20 to be mounted on the portion to be mounted with the device. The inside of the depression 14 is covered with a metal film 16 that is not dissolved by an etching liquid dissolving the metal base material 11. The edge of the opening of the depression 14 is swaged to make the peripheral portion of the metal film 16 form a retaining portion 16a projecting to the inside of the depression 14. The semiconductor device 20 is mounted on the portion to be mounted with a device on the one surface of the metal base material 10 where the retaining portion 16a is formed. The electrode terminal of the semiconductor device 20 is bonded to the inside of the metal film 16 with a bonding wire 22. The semiconductor device 20, the bonding wire 22 and the one surface of the metal base material 10 including the depression 14 are sealed with resin. Then the metal base material 10 is melted and removed to expose the metal film 16.