发明名称 METHOD FOR MANUFACTURING BUS-BAR CIRCUIT BODY
摘要 <p>PROBLEM TO BE SOLVED: To provide a manufacturing method for bus-bar circuit bodies which enables fitting of tabs so as to stand with extremely high fitting strength, adhere solder only to required spots, even if soldering is performed in a solder bath, and manufacture bus-bar circuit bodies very economically. SOLUTION: This method of manufacturing a bus-bar circuit body is composed of an insulating board (8), bus-bars (1) arranged on the insulating board (8), and tabs (3) for electrical contacts fitted to the bus-bars (1). A plurality of bus-bars (1), formed by punching conductor board material (11) into prescribed shapes, are inset-molded along with an insulating board (8), so as not to mold tab fitting holes (2) formed in the bus-bars (1). After the fitting portions (5) of the tabs (3) are press-fitted into the fitting holes (2) and fixed by caulking, they are dipped in the solder bath and soldered.</p>
申请公布号 JP2001359221(A) 申请公布日期 2001.12.26
申请号 JP20000176609 申请日期 2000.06.13
申请人 YAZAKI CORP 发明人 SATOU AKIYOSHI
分类号 H02G3/16;(IPC1-7):H02G3/16;H01R12/04 主分类号 H02G3/16
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