| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of non-lead type package structure in which interference between a wire and a die pad is avoided by solving the problem of insufficient strength of die pad or mismatch of a facility and a jig, and a lead frame for use therein. SOLUTION: (1) In a molded semiconductor device of package structure comprising a semiconductor chip 5 mounted on the die pad 3 of a lead frame 2, and lead terminals 4 from a package for external connection connected with the chip, the semiconductor chip mounting face of the die pad is subjected to half etching 7, an area 9 not subjected to half etching is provided on the outer circumference of the die pad, a bend 8 is formed in the lead frame and a tapered part 10 is provided on the outer circumference of the die pad. (2) The lead frame 2 has the frame structure.
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