| 摘要 |
PROBLEM TO BE SOLVED: To provide a method, in which minute IC chips diced from a wafer are conveyed efficiently to perform tape-mounting. SOLUTION: IC chips and a conveying pipes for flowing a conveying gas are electrified with electric charges of the same code, and each of them is held so as to bring them into noncontact with each other, by a repulsion force due to the electric charges, while being conveyed. Furthermore, by utilizing attraction force due to the electric charges of a different code, the IC chips are mounted at prescribed positions on a tape. |
