发明名称 JET TYPE SOLDERING DEVICE AND NOZZLE
摘要 PROBLEM TO BE SOLVED: To securely complete soldering. SOLUTION: This device has a solder storing means, a circuit board carrying means which carries a circuit board, and a jet means which jets molten solder. The jet means has 1st nozzle holes which are formed obliquely at a 1st angle to the horizontal surface and at a 2nd angle to the carrying direction of the circuit board, and 2nd nozzle holes which are formed obliquely at the 1st angle to the horizontal surface and at a 3rd angle different from the 2nd angle to the carrying direction of the circuit board. The molten solder can sufficiently be stuck on a land irrelevantly to the position of the circuit board where an electronic component is mounted, the size of the electronic component, etc.
申请公布号 JP2001358449(A) 申请公布日期 2001.12.26
申请号 JP20000177038 申请日期 2000.06.13
申请人 AISIN AW CO LTD 发明人 HAYASHI TAKUYA
分类号 B23K1/00;B23K1/08;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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