| 摘要 |
PROBLEM TO BE SOLVED: To surely cut off a fuse for redundancy substitution for a semiconductor device by detecting previously optimum conditions of laser power. SOLUTION: Plural fuses 19 for test having same size as a fuse for redundancy substitution used normally are provided. The fuse for redundancy substitution cuts off a memory cell array part corresponding to an address of a defective part to substitute a memory cell array part having a defect for a memory cell for redundancy according to a result of a pre-wafer-test. Before that, the fuse 19 for test is irradiated with a laser beam making the power variable, voltage is supplied from a power source pad 11, and optimum laser power to cut off a fuse is detected by an output signal from a test output pad 15.
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