BONDING STRUCTURE OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To connect two different multilayer printed wiring boards with each other while keeping the shielding structure. SOLUTION: The two multilayer printed wiring boards 1 and 2 having tilted end surfaces are prepared. The tilted surfaces of the respective printed wiring boards 1 and 2 are arranged in opposition to each other, an anisotropic conductive film 4 is made to interpose between the tilted surfaces, and the two printed wiring boards 1 and 2 are electrically bonded to each other.