| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a composite semiconductor device. SOLUTION: The surfaces for soldering to conductor patterns 16a, 16b use the undersides of electrodes 15a, 15b of a surface-mounted chip resistor 15 to be connected to a semiconductor chip 4 of the composite semiconductor device 10, and the connecting surfaces to which bonding wires 7 are bonded use the upper sides of the electrodes 15a, 15b. This eliminates the need for the area for bonding the bonding wires 7 to the conductor patterns 16a, 16b, thus realizing miniaturization of the composite semiconductor device as a whole. |
