| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip package in which a partially rejectable multi- chip package can be rendered to an acceptable package. SOLUTION: The multi-chip package comprises a substrate 130, a first chip 110 having a plurality of first terminals formed on the substrate 130, a second chip 120 having a plurality of second terminals formed on the substrate 130, a part 150 sealing the first and second chips 110, 120, and a plurality of wiring patterns 140 formed on the substrate 130 while having a part extending to the outside of the sealing part 150 and connected electrically with the first and second chips 110, 120 through the first and second terminals. The plurality of wiring patterns 140 are arranged to short-circuit the part extending to the outside of the sealing part 150 selectively when any one of the first or second chip 110, 120 is a nonfunctional chip and the other is a functional chip thus operating the functional chip. |
