| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat exchanger structure which improves the heat exchanger performance of an water-air heat exchanger and improves the cooling performance of a cooler for semiconductor elements. SOLUTION: The heat exchanger comprises a cooling water pipe 4 being a first member radiating heat or heated, a multi-pipe metal member 21 having a plurality of small holes through which hot air 24 to be a hot fluid flows in contact with the cooling water pipe 4, and a cooling water 5 flowing in this pipe 4. Figure 2 shows the constitution of the multi-pipe metal member 21 containing many straight through-shaped micropipes 22 of several micrometers to several millimeters in diameter. |
