| 摘要 |
PROBLEM TO BE SOLVED: To prevent outflow to a post-process of a defective, due to ball- electrode unjointing, and to improve the reliability of products. SOLUTION: A plurality of solder balls 3 are installed to a tape substrate 2 for a CSP body 7a through reflow, and conductive elastic sheet members 9 are brought into contact with each solder ball 3, and locomotive power is imparted and unjointed solder balls 3b are removed by imparting locomotive power, capable of moving the unjointed solder balls 3b which are not joined with the tape substrate 2 in the solder balls 3, while using the elastic sheet members 9 composed of a material softer than solder, thus preventing outflow to the post-process of defectives due to the ball-electrode unjointing. |
