| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMOS camera the size and the cost of which are reduced. SOLUTION: The CMOS camera is provided with a wiring board 21 to which an image pickup opening section 22 is formed, a lens unit 3 that is provided in the one side of the wiring board and has a lens 2 placed opposite to the image pickup opening section, an image pickup semiconductor 4 that is placed opposite to the image pickup opening section on the other side of the wiring board and flip-chip-connected to a connection section of the wiring board, and an image processing semiconductor 9 that is flip-chip-connected to other connection section on the other side of the wiring board and processes an image signal from the image pickup semiconductor.
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