| 摘要 |
An interconnect for electrically contacting semiconductor components such as bare dice, wafers and chip scale packages, is provided. The interconnect includes a rigid substrate and polymer contact members formed on the substrate. The polymer contact members are adapted to electrically engage contacts (e.g., bond pads, solder bumps) on the component. In one embodiment the polymer contact members are raised members with penetrating projections covered with conductive layers. In another embodiment the polymer contact members are indentations and penetrating projections covered with conductive layers. A method for fabricating the polymer contact members includes the steps of depositing, patterning and etching a thick film resist. These steps are followed by electrolessly depositing conductive layers on the contact members, and conductors in electrical communication with the conductive layers.
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