发明名称 RESIN COMPOSITION, PRESSURE-SENSITIVE ADHESIVE, AND THE USE
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin composition which, when stuck to the surface of plastic moldings, can prevent blistering, such as bulging or rolling up, and to provide a pressure-sensitive adhesive composition, a pressure-sensitive adhesive sheet, and a sheet or plastic laminate prepared by using the composition. SOLUTION: This resin composition is obtained by copolymerizing (A) 80-99 wt.% alkyl (meth)acrylate monomer and (B) 1-20 wt.% carboxylatedα,β- ethylenically unsaturated monomer in acetone and has a wt. average mol.wt. of 1,500,000 or higher and a ratio of wt. average mol.wt./number average mol.wt. of 4.0 or lower. When a composition prepared by compounding the above composition in an amount of 100 pts. with 2 pts. trimethylolpropane adduct of tolylene diisocyanate is applied in a coating wt. of 20 g/m2 to polyethylene terephthalate and then laminated to a polycarbonate sheet and the resultant laminate is left standing in an oven at 100 deg.C for 30 days, blistering does not occur.</p>
申请公布号 JP2001354745(A) 申请公布日期 2001.12.25
申请号 JP20000174678 申请日期 2000.06.12
申请人 TOYO INK MFG CO LTD 发明人 ARIYOSHI YASUSHI;AZUMA HIROKO;CHIYOUSOKABE HIROSHI
分类号 B32B27/00;B29C65/54;C08G18/62;C09J7/02;C09J133/04;(IPC1-7):C08G18/62 主分类号 B32B27/00
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