| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition of solder which is so called a Pb free solder and gives no damage to a substrate even in a case where a conductive material formed on such a ductile substrate as glass is soldered, and has an excellent heat resistance, and to provide a soldered article. SOLUTION: The composition of the solder is characterized by the fact that the composition includes 90 wt.% or more of a first metallic element composed of Bi, a second metallic element the 9.9 pts.wt. or less of which forms a binary eutectic crystal with 90 pts.wt. or more of the first metallic element, and further 0.1 to 3.0 wt.% in total of a third metallic element, among the 100 wt.% of the solder component, the composition does not include an eutectic crystal of a low melting point whose solid-phase line temperature is less than 200 deg.C, and does not include Pb except inevitable impurity. |
