| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which hardly causes a package warp, has good flowability, is excellent in moldability and solder heat resistance during packaging, does not cause cracks, has an excellent adhesiveness and excellent moisture resistance after mounting and ensures long-time reliability, and to provide a one-side-sealed BGA-type semiconductor sealing device. SOLUTION: This resin composition essentially contains (A) an epoxy resin prepared by mixing (a) a bisphenol A-backbone polyfunctional epoxy resin with (b) a biphenyl-backbone epoxy resin in a ratio of (a)/(b) of 0.1-2.0, (B) a polyfunctional phenol resin, (C) an inorganic filler, and (D) a cure accelerator, the content of ingredient C being 25-95 wt.%. The one-side-sealed BGA-type sealed semiconductor device is obtained by sealing a semiconductor chip with a cured product of the resin composition.
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